Hot melt molding
Due to low temperature, low pressure, and low-speed molding, there is less stress on electronic components and printed circuit boards!
"Hot Melt Molding" is a molding technology using adhesive-based resins (polyamide, polyester, polyolefin). It is suitable for protecting substrates and electronic components using one-component thermoplastic resins. Due to its high adhesive strength, it excels in waterproofing, drip-proofing, and dust-proofing, and the molds can be smaller, which helps reduce initial costs. 【Features】 ■ Minimal stress on electronic components and printed circuit boards ■ Excellent waterproofing, drip-proofing, and dust-proofing due to high adhesive strength ■ Smaller molds help reduce initial costs ■ Resolves surface irregularities and void issues during potting *For more details, please refer to the PDF document or feel free to contact us.
- Company：アキヤ電気 本社・工場
- Price：Other
